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CSME 2019/10
Volume 40 No.5
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439-448
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Analysis on Temperature Field Simulation for Offset Cutting a Nanochannel at a Fixed Down Force on Single-crystal Silicon Using Three-dimensional Quasi-steady Molecular Statics Nanocutting Model
Zone-Ching Lina, Yu-Jheng Hua and Bo-Tang Zhaoa
aDepartment of Mechanical Engineering, National Taiwan University of Science and Technology, No.43, Keelung Rd., Sec.4, Da'an Dist., Taipei City 10607, Taiwan
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Abstract:
The paper develops three-dimensional quasi-steady molecular statics nanocutting model to simulate offset cutting a nanochannel trapezium groove on single-crystal silicon at a fixed down force by a small probe. It is set that after a cutting pass is performed at a fixed down force on each cutting layer, the probe offsets rightwards to perform one more cutting pass, and then offsets leftwards to the middle position between the two passes aforesaid to perform cutting– this process is regarded as an offset cutting. The down force and cutting force of each cutting pass on the first cutting layer obtained from simulation of three-dimensional quasi-steady molecular statics nano-cutting model are compared with the down force and cutting force of the cutting pass on the first cutting layer obtained from SDFE theoretical equation. The comparison has proved that it is feasible to use the three-dimensional quasi-steady molecular statics nanocutting model developed by the paper to simulate offset cutting of nanochannel trapezium groove at a fixed down force on single-crystal silicon by a small probe. The paper considers that plastic heat and friction heat would be produced during cutting of every cutting pass. The plastic deformation heat of the paper can be calculated by multiplying the equivalent stress and equivalent strain of the workpiece of single-crystal silicon being cut. Focusing on the production method of friction heat on the surface of cutting tool for nanocutting of single-crystal silicon, the paper finds the calculation method of temperature rise produced from friction heat. After finding the sum of temperature rise produced from two heat sources, the paper achieves the total temperature rise of each atom of the single-crystal silicon workpiece being cut, and then analyzes the temperature field of each cutting pass on the first cutting layer when performing offset cutting at a fixed cutting force.
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Keywords: molecular statics, nanochannel, offset cutting, specific down force energy, temperature field
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*Corresponding author; e-mail: zclin@mail.ntust.edu.tw
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©
2019
CSME , ISSN 0257-9731
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