|
CSME 2019/12
Volume 40 No.6
:
595-604
|
|
Analytical Model for the Assessment of Vertical Elliptic Vibration Assisted Grinding of Brittle Material
Deng-Ling Chena, Yun-Feng Pengb and Chen-Chun Shib
aDepartment of Mechanical and Electrical Engineering, Xiamen University, Xiamen, 361005, China; Shenzhen Research Institute of Xiamen University, Shenzhen, 518057, China
bDepartment of Mechanical and Electrical Engineering, Xiamen University, Xiamen, 361005, China; Shenzhen Research Institute of Xiamen University, Shenzhen, 518057, China.
|
Abstract:
In the past, researches mainly focused on the feasibility of the vibration assisted grinding in machining some brittle materials and the mechanism study is still absent. In this paper, an analytical model is presented to interpret the material removal mechanism of vibration assisted grinding brittle material. The model investigates the cutting kinematics of single grinding grain and the stress condition alone the equivalent shear plane within the chip formation zone. The theoretical analysis combined with the experimental result show that the proposed analytical model can be used to explain the material removal mechanism of vibration assistance grinding of brittle material.
|
|
Keywords: Elliptic vibration-assisted grinding, Material removal mechanism, Equivalent shear plane, Brittle material, Stress condition.
|
Download PDF
|
|
*Corresponding author; e-mail:
|
©
2019
CSME , ISSN 0257-9731
|