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CSME 2021/06
Volume 42 No.3 : 255-261
 
Simulation Study On The Heat Transfer Rate Of Thermal Modules With Different Fin Array Modes

Po-An Chena and Ruey-Yih Tsaib
aDepartment of Mechanical Engineering, Chung Yuan Christian University, Taoyuan, Taiwan 32023, ROC.
bDepartment of Mechanical Engineering, Chung Yuan Christian University, Taoyuan, Taiwan 32023, ROC.


Abstract: This study uses Flotherm software to investigate the heat transfer rate of thermal modules with different fin array mode. A thermal management system addresses high-power issue in electronic chips. As the chip-power increases, corrective measures can reduce elevating temperatures. The chip powers and different thermal systems are compared including heat sinks and cold-fluid circulation systems. Integrating aforementioned systems can help evaluate each component’s trends and clarify the results of the thermal system mechanism. When the power is increased to 45 W, the 15-pin heat sink is the optimal thermal system. A flat-type heat sink is recommended over a square-type heat sink. In addition, fixing the positions within the cold fluid system is the main focus of this study as it is closely related to the sufficient space for faster heat circulation; this implies that the closer it is to the chip center, the higher will be the chip temperature.

Keywords:  thermal simulation, thermal management, heat sink, junction temperature.

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© 2021  CSME , ISSN 0257-9731 





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