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CSME 2022/10
Volume 43 No.5 : 399-410
 
Considering Different Temperatures and Volume Concentrations of Slurry to Esitablish Simulation and Regression Analysis Model of Abrasive Removal Depth of Silicon Wafer for Chemical Mechanical Polishing

Zone-Ching Lina, Pin-Xiang Luob and Wei-Lin Chenb
aOpto-Mechatronics Technology Center (OMTC), National Taiwan University of Science and Technology, No.43, Keelung Rd., Sec.4, Da'an Dist., Taipei City 10607, Taiwan
bDepartment of Mechanical Engineering, National Taiwan University of Science and Technology, No.43, Keelung Rd., Sec.4, Da'an Dist., Taipei City 10607, Taiwan


Abstract: The paper firstly soaks silicon wafer in slurry atdifferent temperatures and different volume concentrationsfor 30 minutes, and then performs atomicforce microscopic (AFM) experiment to calculate thespecific down force energy 𝑆𝐷𝐹𝐸(reaction) values ofsilicon wafer soaked in slurry at different temperaturesand different volume concentrations. These𝑆𝐷𝐹𝐸(reaction) values are substituted into an innovativelyestablished theoretical simulation model ofabrasive removal depth of silicon wafer under chemicalmechanical polishing (CMP) by a pattern-freepolishing pad soaked in slurry at different temperaturesand different volume concentrations. First of all,the paper conducts CMP of silicon wafer by a patternfreepolishing pad with slurry at different volumeconcentrations at room temperature, and thencompares the experimental results with the simulationresults. After that, the paper makes a comparisonbetween the simulation result and experimental resultof abrasive removal depth per minute and finds the averagedifference ratio. After applying the modificationconcept of average difference ratio, the simulated abrasive removal depth per minute being close to theexperimental value after compensation and modificationcan serve as a parameter value being similar toexperimental value for regression analysis. Finally,the paper establishes a compensatory regressionequations with consideration of different temperaturesand different volume concentrations.



Keywords:  abrasive removal depth, regression model, temperatures, volume concentrations, pattern-free polishing pad

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*Corresponding author; e-mail: zclin@mail.ntust.edu.tw
© 2022  CSME , ISSN 0257-9731 





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