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CSME 2021/06
Volume 42 No.3
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295-301
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Chassis Skin Temperature Transient Prediction Model of Electronics Devices
Sheng-Chao Lin a, Ruey Tsai a, Kuan-Yu Chena and Chia-Pin Chiub
aDepartment of Mechanical Engineering, Chung Yuan Christian University. No. 200, Chungpei Rd., Chungli District, Taoyuan City, Taiwan 32023, R.O.C.
bIntel Corporation, 5000 W. Chandler Blvd. Chandler, Az 85226, USA
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Abstract:
An electronic device chassis skin temperature transient response prediction model is proposed. This model optimizes dynamic thermal control parameters using simulations. The thermal interaction between the chassis skin, chassis material and environment were analyzed and simplified into an energy balance equation. By solving this equation, chassis skin transient thermal response function corresponding to the processor temperature is established. The system prediction model was built after identifying the system parameters. This approach quickly establishesthe chassis skin temperature transient model for an electronics system without complicated calculations or time consuming CFD modeling processing. The experimental data shows the error is within 1.43 °C (9.1%) and 6000 prediction calculation seconds within the Microsoft® Excel™ environment. This model benefits engineers interested in electronic device optimizing system performance using simulations.
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Keywords: thermal transient prediction, chassis skin temperature, system performance, performance optimization
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*Corresponding author; e-mail:
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©
2021
CSME , ISSN 0257-9731
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